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MCU Reverse Engineering

Reverse engineering of semiconductor-based products can broadly take several forms:

* Product teardowns: identify the product, package, internal boards, and components of “downstream” consumer products.
* System-level analysis: analyzes operations, functions, timing, signal paths, and interconnections.
* Process analysis: examines the structure and materials to see how a device is manufactured and what it is made of.
* Circuit extraction involves delayering to the transistor level, then extracting interconnections and components to create schematics and netlists.

 

IC Circuit extraction flow proceeds as follows:

* Package removal or device depot
* Delayering
* Imaging
* Annotation
* Schematic read-back and organization
* Analysis

 

 

To find out how Hualan Technologies can help, just give us a call, or contact us with your project details!

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